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Distributors for
POTTER & BRUMFIELD

SSRQ series
QUAD AC OUTPUT
SOLID STATE RELAY


A division of:
Logo
Siemens Electromechanical Components, Inc.



Relay Image
POTTER & BRUMFIELD 
SSRQ series
QUAD AC OUTPUT
SOLID STATE RELAY

File E29244
File E29244 UL Recognized for Canada






FEATURES
· Four electically independent solid state relays in a single industry
  standard "hockey puck" package.
· 20A rms, triac outputs.
· DC input control.
· Zero voltage and random voltage turn-on versions.
· 2500V rms optical isolation.


ENGINEERING DATA:
Form: 4 Form A (SPST-NO).
Duty: Continuous.
Isolation: 2500V rms minimum, input - output.
Isolation Resistance: 10^10 ohms @ 500VDC minimum.
Capacitance: 10 pf maximum (input to output).
Temperature Range:
   Storage: -40"C to +120"C
   Operating Temperature: -25"C to + 80"C
Case Material: Plastic, UL rated 94V-0.
Base Plate Material: Ceramic.
Case and Mounting: Refer to outline dimension.
Termination: Refer to outline dimension.
Approximate Weight: 3.10 oz. (81 g).


INPUT SPECIFICATIONS:
Parameter                            Zero V Turn-on       Random V Turn-on
Control Voltage Range Vin            3-32VDC              4-15VDC 
Must Operate Voltage Vin(op)(Max.)   3VDC                 4VDC
Must Release Voltage Vin(rel)(Min.)  1VDC                 1VDC 
Input Current (Max.)  Vin=5VDC       15mA DC              15mA DC




OUTPUT SPECIFICATION (@ 25 degrees C, unless otherwise specified):
50K .jpg (780 pixels wide).



ELECTRICAL CHARACTERISTICS (Thermal Derating Curves):

HOW TO USE THESE CURVES
Knowing maximum load current and maximum ambient temperature, use derating curves to determine the minimum required heat sink and maximum allowable base plate temperature. On left hand power dissipation curve, locate the point corresponding to maximum load current. Extend a line to the right from that point to the intersection of vertical line on right hand chart corresponding to maximum ambient temperature. From heat sink curve, read directly or extrapolate required heat sink size. Extend the line farther to the right and read on the right hand scale the maximum allowable base plate temperature.
Thermal Derating Curves (61K .jpg 780 pixels wide).



HEATSINK DIMENSIONS:

· We recommend that solid State Relay Modules be mounted to a heatsink sufficient to maintain the module's base temperature at less than 85 degrees C under worst case ambient temperature and load conditions.
· The heatsink mounting surface should be a smooth (30-40 micro-inch finish), flat (30-40 micro-inch flatness across mating area), un-painted surface which is clean and free of oxidation.
· An even coating of thermal compound (Dow Coming DC340 or equivalent) should be applied to both the heatsink and module mounting surfaces and spread to a uniform depth of .002" to eliminate all air pockets.
· The module should be mounted to the heatsink using two #l0 screws. The mounting screws should be torqued to 10 inch-pounds by alternately tightening the screws one quarter turn at a time.


OUTLINE DIMENSIONS
(approx. 26K .gifs @ 750 pixels wide).

BUILD YOUR OWN PART NUMBER:
A 24K graphic (GIF) of Ordering Information.
This information will 'build' a part number from a list of available specifications.




© 1997 Potter & Brumfield Products Division,
Siemens Electromechanical Components Inc.


Bullet POWER RELAYS:
KUHP, S86/87, PM, PRD
Bullet SOLID STATE RELAYS:
SSRT, SSR, SSRD, SSRQ
Bullet SOLID STATE MODULES:
IAC, OAC, IDC, ODC
Bullet TIME DELAY RELAYS:
CND, CNT, CNS, CNM5
Bullet GENERAL PURPOSE:
R10, KH, KHA, KHAU
Bullet GENERAL PURPOSE:
KRP, KRPA, KR-E, KR-3-H, KA
Bullet GENERAL PURPOSE:
KUP, KUEP, KUIP, KUGP, KUMP, KUP93
Bullet VOLT/CURRENT SENSORS:
CS, SDAS-01
Bullet CIRCUIT BREAKERS
W28, W58
Bullet HOME PAGE Bullet POTTER BRUMFIELD MENU  

Logo Call: 414-327-1555
Fax : 414-327-0577
Email: iebyross@yahoo.com
Catalog, Quote, Availability.


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© 2011 Industrial Electronics Corp. of Wisconsin